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WHAT THEY Say

"HOOPS® offered us an improvement in graphics acceleration without compromising on the quality of the models, which was pre-intregrated with Qt, on UI toolkit of choice. We also appreciated the ability to license the Parasolid Kernel from Tech Soft 3D."

Development Team
EMSS Consulting
IXUS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Electronic Design Automation Customers

Tech Soft 3D components have proven to be valuable building blocks in a wide range of electronic design and automation applications such as design for electronics, computer chips, circuit boards - and every type of solution in between. Below are just a few of the ways firms in the EDA sector make use of our suite of robust components:

Coventor

 

HOOPS/3DAF helped Coventor capture the largest installed base of MEMS (micro-electrical-mechanical systems) design software in the world by getting them to market quickly with an advanced pre-processor that combines the graphics power of HOOPS with the modeling strengths of ACIS.

Read the complete case study >

Feko

FEKO is EMSS' advanced 3D field simulator for analyzing electromagnetics and an extremely popular cross-platform application in the aerospace, automobile, defense and communication industries. EMSS worked closely with TS3D to integrate HOOPS, Parasolid and InterOp into FEKO and take their pre- and post-processors to an entirely new level of performance, usability and capability.

- Read the complete case study >

Japan Research Institute

JRI Solutions is the software development arm of the venerable Japan Research Institute. When the company decided to make a significant investment in their electro-magnetic field analysis software, JMAG – they turned to HOOPS. Working closely with the services team at TS3D’s Japanese partner, Spatial, JRI was able to produce a new generation of JMAG with significant performance and functionality gains. The move to HOOPS was so successful that JRI is now in development of additional applications that will be powered by HOOPS.

Visit: JRI Solutions >

mentor graphics

Flomerics, now owned by Mentor Graphics, works with TS3D to supply the company’s FloEFD software for fluid flow and heat transfer analysis. Using 3D InterOp, the FloEFD team is able to offer accurate and robust translation of a range of popular MCAD formats – opening new sales opportunities and adding significant value to the overall solution.

Visit: www.mentor.com >

Waferdata

Datavision is a versatile data analysis product that also provides automation, SPC, trending and cross correlation of large volumes of data from multiple sources to the semiconductor industry. Since its inception, Waferdata, the creators of Datavision have relied on HOOPS for its’ simple interface, cross-platform capability and strength in both on-screen and hardcopy display.

Visit: www.waferdata.com >