HOOPS Scene   Volume Two 2006

PRODUCT UPDATES

Our latest HOOPS release is imminent. Customers should look for an announcement shortly. As you’ll see, we’ve made this the most feature-packed release of HOOPS yet, as the size and experience of our R&D team continues to grow. To read more about how HOOPS 14.0 can add power to your application, check out the highlighted features list.

Check out the features of our latest release

3D InterOp / Parasolid Integration  

The Parasolid Community now has a rich set of MCAD data translators available to extend their 3D applications. We’ve developed an integration between Spatial’s InterOp technologies and the Parasolid Kernel. You’ll find all of the major MCAD formats available, including the only native read/write CATIA solution on the market today.

Find out about Spatial's 3D InterOp

Find out about Parasolid's Kernel Modeler

Read the Press Release

DWF Integration  

HOOPS/3dAF users may now read and write Autodesk DWF files

The integration of DWF into HOOPS/3dAF is now complete. With the DWF Toolkit from Autodesk, applications using the HOOPS framework will be able to add export functions for 2D and 3D DWF files simply by downloading the DWF Software Development Kit (SDK) from Autodesk. Please contact us if you are interested in DWF import. No additional development or fees are required.

Find out more about the integration.

Download Autodesk’s DWF Viewer.

COMPANY CHANGES

You may have seen the press release, gotten the email or looked us up and found that Tech Soft America has changed to Tech Soft 3D.

We’re celebrating our 10th anniversary since our rebirth as an independent company in 1996 by moving to a name that reflects our growing global business and 3D solutions focus.

While it may seem like a small change, we actually did go through a long list of other names before we decided on Tech Soft 3D. Just for fun, we'd love to know what you think of the Top Ten name candidates. Tell us what you think and you may just be a lucky recipient of a Tech Soft 3D t-shirt!

Take the survey!

New Contact Information

Please note TS3D has also moved offices to our newly purchased headquarters in Berkeley, California.

Check out our contact page to find out the details.

Email addresses are now: FirstName@techsoft3d.com

We've tested everything out so you shouldn't have any trouble finding us, but if you spot a glitch, please let us know at: info@techsoft3d.com

MEET THE TEAM

Travis Heppe

Technical Support Manager and Member of Technical Staff

One of the two longest-serving engineers at TS3D, Travis' primary role is as a developer of new HOOPS features.

Find out more about Travis

TRAINING DATES

Dates: August 28th - 30th
Location: Berkeley, CA
Toolkit: HOOPS 3D Application Framework

The program involves 3 days of classroom sessions and programming exercises followed by 1 day of one-on-one assistance for application-specific issues or custom prototyping.

Get more information on the course.

PROGRAMMERS' NOTES

Technical Questions

Can I modify the color of a shell's visible edges?

Is it possible to import a set of SAT / STL files into one window of the PartViewer?

Got questions about the HOOPS 3D Product Suite? Visit the HOOPS Forum.